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Intel BD82HM55 BGA Chipset With Lead Solder Balls
Item Number: BD82HM55
Category: INTEL
Condition: New
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Description
Intel BD82HM55 BGA Chipset With Lead Solder Balls
Lead solder balls' melting point is 180C 210C-215C is the best melting temperature.
Lead Free solder balls' melting point is 217C 235C-245C is the best melting temperature.
The temperatures listed above are the chip's solder balls actual temperatures (they are measured by the measuring wire on the BGA machine),but not the temperatures from the BGA rework station's top bottom heat guns.
*If soldering a new Lead solder balls chip with Lead Free temperature curve (profile), it will overheat the new chip.*
*If soldering a new Lead Free solder balls chip with Lead temperature curve (profile), it will not completely melt the lead free solder balls on the new chip.*